Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Teo Juno
> 3 dayJai refait la pâte thermique sur une ps3, la pâte est génial :)
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C. michel
> 3 dayexcellent produit.
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MKT
> 3 daySuper produit rien à redire
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Ginger
Greater than one weekEasy to use had no problems keeps my r7 5800x3d nice and cool
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Warren Brady
08-06-2025Lowered temps on my 4790k by 10 degrees c using a hyper t4
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Prof. Jakob Veum PhD
> 3 dayWorks as advertised, but more happy about the 3 to 4 year shelf life.
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nathalie sonet
> 3 daybien reçu sans souci
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Jio
> 3 dayit does the thing :)
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natsuvongola
> 3 dayacheter pour remplacer mon ancienne artic silver 5 je en regrette pas mon achat je la trouve même plus performante
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Gorden
> 3 daybought this paste to remount my CPU cooler ( Cooler master hyper 212 Evo) my old thermal paste was not bad, or so I thought , where my CPU (AMDFX6300 non OC) ran about 18 Degree C idle and about 28-30 Degree C under full load using Prime 95. After applying this paste however I was shocked to see a min 10 Degree Celsius drop in Idle Temperatures, as well under full load my CPU now runs at 18 Degree Celsius , my new Idle temps seem to float around 7 Degree Celsius, Ive seen it drop to 4. I use HWMonitor for the temperature results as well as Speccy, both indicate identical results, would buy again and would recommend for anyone who needs to reply paste, or just wish to improve on pre applied or stock paste.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
