Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
-
CONSERJEITOR
> 3 dayPerfecto
-
Zeth
Greater than one weekDesde la viscosidad se nota el cambio con pastas más simples y los resultados que da en temperatura son notorios, la presentación da para ser duradera, unas de las mejores pastas térmicas.
-
Nate
> 3 dayI use this on pretty much every PC in my house and for family & friends builds. It has dropped temps on almost everything I have applied it to when replacing old or factory pastes. There might be some better or comparable pastes out there, but this hasnt let me down yet.
-
Georges
> 3 dayTrès bonne pate thermique.
-
ribana karahasanovic
> 3 dayPâte de trés bonne qualité ma ps4 et la switch de ma fille ne chauffe plus je recommande très bon produit
-
Pedro nunez
> 3 dayGood
-
Ismael garcia guzman
> 3 daySuper eficiente soluciono notablemente el problema de calentamiento de mi cpu bajo muchisimo la temperatura en comparacion a otras pastas reconocidas k e utiñuzado anterior mente
-
Iván Ruso
Greater than one weekUsada en una Play4 pro y sorprendido por su efectividad. De parecer un avión despegando, a casi ni oirla. También cambié los pad térmicos por otros de Artic y el cambio es brutal. Excelente pasta térmica. Recomendadísima.
-
Luis Fernando Aguiar
> 3 dayAbaixo bastante a temperaturas do cpu e gpu
-
starpass101
> 3 dayyou only need a little for it to work
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
|
|
|
|
|
|---|---|---|---|
Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
|
|
|
|
|
|
|
|---|---|---|---|---|---|---|
| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
Related products
