Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Ken
> 3 dayBought this after trying IC Diamond. That stuff is just too thick. This is much easier to work with and keeps everything nice and cool. Im using on my CPU and GPU.
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Souchko
> 3 dayFacile dutilisation
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Umang V.
> 3 dayGot 10-15% cooling after the application... amazing product
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Stepside
> 3 dayEvery bit if not better than Artic Silver 5 on my Hyper 212 Heatsink.
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Carmelo
18-11-2024Pasta termica ottima da sostituire a quelle data di default con il processore che si compra , o perfetta per sostituirla a quella vecchia.
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Vastman
Greater than one weekHo provato altre marche che costavano meno, ma le prestazioni erano basse, questa costa ma è eccellente abbassa parecchio le temperature della CPU.
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D. C.
> 3 dayBuona pasta termica e buon rapporto qualità prezzo. Con questo peso, ci potrò fare tante applicazioni.
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Enrico Vanoni
20-11-2024Ottima pasta termoconduttiva, sostituendola ad una thermalright ho abbassato le temperature di 7-8 gradi in full load su i7 7700k deliddato è raffreddato a liquido con masterliquid 240
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Bern64
21-11-2024Pâte thermoconductrice impeccable. Facile à lusage. Placée sous forme de goutte avec la seringue puis étalée sans problème. Nickel. très content. Vu la quantité jen ai encore pour une dizaine de pc portable ...
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Christian Gautier
> 3 dayCette pâte sétale facilement, elle assure un très bon contact entre le processeur et le système de refroidissement.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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