Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Geovanny Medina
> 3 dayDe temperatura me ha sorprendido en rederizacion de vídeos no está nada mal.
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Mrs. Katlyn Wisoky MD
> 3 daypermet de très bons contacts pour évacuer la chaleur
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Massimo
> 3 dayFra le migliori paste termiche. Facile da stendere. Buoni risultati con il mio pc.
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Giovanni Robel
> 3 daymeilleure que lartic silver 5 et plus facile a appliquer et nettoyer. Je recommande a tous mes amis qui monte une nouvelle config
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Maxime VERGNORY
> 3 dayJai utilisé cette pâte pour réparer ma PS4 qui faisait un bruit davion de chasse au décollage !!!
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gloria lopez
> 3 dayMuy buena pasta termica
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Mark S
> 3 dayWorked perfectly
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MELODIE
Greater than one weekUtiliser pour ma PS4 pro nickel
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Nvoxik
> 3 dayOne of the best thermal paste I have ever used. Getting very respectable temp drops compared to the stock thermal compound in my Ryzen CPU. It truly began to shine when paired with my new air cooler. Was getting around 80c under full load with stock cooler and paste, and now I am getting no more than 55c on full load with this paste and new cooler. Thanks guys for making a great product.
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J & K
> 3 dayGreat quality stuff here. Upgraded my CPU and have it overclocked with an aftermarket Cryorig H7 cooling fan and at 100% load my CPU sits at about 70C. If I had water cooling I’m sure the temp would go down, but this thermal paste is definitely helping!
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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