Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Prof. Clyde Buckridge DDS
17-11-2024Buon prodotto. Speravo di abbassare la temperatura della cpu di qualche grado in più, ma qualcosa ha fatto comunque. Prima di usarla, le temperature in idle erano sempre intorno a 34/35 gradi, ora invece è scesa a 32/33.
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bon bernadette
> 3 daytres bien
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MICHAL CZAJKA
> 3 dayGreat, good stuff not from China, Made in Austria. Used for my laptop. Thanks
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Chris Robinson
> 3 dayI bought this because in order to access the motherboard on my PS4 you have to remove the heatsink. I tried heatsink tape first because I had some on hand, but that caused the console to overheat and shut down. I switched to this and my PS4 is back up and running nice and cool.
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Tanmay bhoi
20-11-2024Working fine, but did not come in original packagin.
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Chaz Beer
> 3 dayProduit toujours de qualité. Au top
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Cosmic Girl
> 3 dayExcelente pasta térmica. El tiempo dirá si modifico la reseña. Pero de momento va muy bien para el procesador de mi PS4 Pro.
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Jesus Prado
> 3 dayEl precio es bajo en funcion a su calidad, se aplica facilmente y no requiere tiempo de secado. En mi caso, lo use en PS4 y a los minutos ya estba jugando
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NickerNerd
Greater than one weekExcellent Product!!
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Navraj Thapa
Greater than one weekNOTE: REVIEWING MY APPLICATION USAGE ON A DESKTOP. CANNOT CONFIDENTALLY GUARANTEE THE SAME RESULTS FOR LAPTOPS, FOR NOW.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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