Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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barate06
> 3 dayJadore ce produit jai bientôt fini mes stocks, je vais en racheté chez ce fournisseur
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Karim Ferrara
Greater than one weekUna delle migliori paste termiche in circolazione, non liquida e si applica facilmente ,ormai uso solo questa, sia per CPU che per GPU
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EmatuM
> 3 dayUne des pâtes thermiques les plus utilisés. Top, rien à dire.
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Andrew C.
> 3 dayMade my PS4 Pro go from sounding like a plane ready for take off to completely silent, even during MW lobbies.
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Antonio
> 3 dayMuy buena calidad, me la recomendaron y la verdad que acerté.
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Javier López
> 3 dayEnvío rápido. Buena calidad de la pasta que mantiene la temperatura estable. Fácil de aplicar al ser muy densa quedando una capa uniforme.
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César C.
> 3 dayLa verdad es que muy bien. Hacía tiempo que necesitaba abrir el portátil y cambiar la crema que lleva por defecto puesto que el equipo tiene ya 6 años. Tras colocar la crema en los tres puntos donde se requería, las temperaturas han bajado del orden de entre 7 y 11 grados según que sensores. Por tanto, pasar de los 60-70 grados a los 50-60 no está nada mal.
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miyas
> 3 dayCest un produit de marque et de très bonne qualité, il correspondait tout à fait à mon besoin. Je ne suis pas déçu.
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Francisco C.
> 3 dayAmazon debería regalar algo a sus clientes , sin efectuar ninguna compra...Seria todo un detalle.
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Mercedes Jimenez
> 3 dayUsed to replace original Xbox thermal paste!
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
